St Andrews HCI Research Group


Dec 2015

TEI 2016 Workshop on Tangible Data, explorations in data physicalization

Tangible Data, explorations in data physicalization @ TEI’16 Eindhoven 14th & 16th Feb 2016
Call for Participation
We are pleased to announce our studio-workshop “Tangible Data, Explorations in Data Physicalization”, which will take place at TEI’16 in Eindhoven on the 14th and 16th February 2016. This workshop addresses both experienced researchers and practitioners as well as those who are new to the field but interested in applying Data Physicalization to their own (research) practice. The workshop will provide opportunities for participants to explore Data Physicalization hands-on, by creating their own prototypes built with tangible media including digital fabrication technologies. These practical explorations will lead into reflective discussions on the role tangibles and embodiment play in Data Physicalization and the future research challenges for this area.

The aim of this workshop is:

  • To create an awareness of the potential of Data Physicalization by providing an overview of state-of-the-art research, practice, and tools
  • To build a community around this emerging field and start to discuss a shared research agenda.

The workshop will be divided into three phases, each focusing on a different aspect of physical data representation. Phase 1 and 2 will be held over the course of day one (14th Feb), while part three will take place over a half-day session (16th Feb).
For the full schedule of the workshop please see here:
Important Dates
TEI’16 early registration deadline: December 23, 2015
Workshop: February 14th & 16th 2016
To sign up for the workshop please go here:

  • Trevor Hogan, Cork Institute of Technology, Ireland
  • Eva Hornecker, Bauhaus-Universität Weimar, Germany
  • Simon Stusak, University of Munich, Germany
  • Yvonne Jansen, University of Copenhagen, Denmark
  • Jason Alexander, Lancaster University, United Kingdom
  • Andrew Vande Moere, KU Leuven, Belgium
  • Uta Hinrichs, The University of St Andrews, Scotland
  • Kieran Nolan, Dundalk Institute of Technology, Ireland

For further enquiries please email: